Name: 三軸半自動焊線機 WB-300-U - 兆勗企業
SKU: WB-300-U
Availability: InStock

Semiautomatic Wire Bonder WB-300-U

Brand：德國UNITEMP
Very compact table top unit, mouse controlled x,y,z-axis
Wedge/Ball and secure Ball Bonding with gold or aluminium wire (17…50 µm)
Motorzed Deep Access Bondhead: Z-axis 50 mm, Accuracy 1.0 μm, Bond arm length 165 mm
Motorized x-y table: Fine table motion 50 x 50 mm, Accuracy 1.0 μm
Optional: microscope / binocular

Specification

Model	WB-300-U
Bond methods	Wedge, Ball, Bump and secure Ball bonding
Gold / Aluminium wire diameter	17 – 50 μm
Ultraonic system	PLL控制62 kHz，功率2 W
Bond Time	5 – 5000 msec.
Bond Force	5 – 100 cN
Sensor	Wedge and Ball Transducer
Bond Tool	1.58 dm × 19 mm (0.0626″ × 0.750″)
Motorized Axes	Z-axis 40 mm，Y-axis 50 mm，X-axis 50 mm
Power Supply	100 – 240 V，50 – 60 Hz，Max. 5 A
Dimension	580 × 510 × 490 mm
Weight	45 kg

Semiautomatic Wire Bonder WB-300-U