真空迴焊爐 VSS-300
FortuneTell ▶ Products ▶ Production & Rework ▶ 印刷機/貼片機/貼片機耗材/迴焊爐 ▶ Vacuum Soldering System VSS-300

Vacuum Soldering System VSS-300

SKU: VSS-300 Category: Tags: , ,
  • Brand：德國UNITEMP
  • Application: Reflow Solder Processes with flux, Operation with inert gas, Oxygen, Forming gas, Formic Acid, Lead and Lead-free SMT reflow, Resistor paste firing, etc.
  • Precise ramp up and fast ramp down rates
  • Up to 4 gas lines
  • Heated by Infrared Lamps
  • 50 programs with 50 steps each
  • Top and bottom heating (selection by Software)
  • 3 heating zones programmable

Specification

ModelVSS-300
Max. part size300 × 300 mm
Chamber Height75 mm（可選120 mm）
Vacuum Capability10-3 hPa（可選10-6 hPa）
Max. Temperature450°C
Temp. uniformity≤ 1 % of set temperature (on a 200 mm wafer)
Bottom HeatingInfrared lamps cross aligned (18 kW)
Ramp up rate150 K /min
Ramp down rateT = 450°C > 200°C：90 K/min，T = 200°C > 100°C：60 K/min
Flow ControllerMass Flow Controller (Nitrogen 5 nlm= norm liter per minute)
Controller7“ touch panel, 50 programs storable each with 50 segments
Chamber CoolingWater cooled
Substrate CoolingBy Nitrogen Gas
DimensionW540 × D690 × H890 mm
Weight120 kg
Voltage400V/2305V，18 kW

Option

ItemDescription
VSS-MFC-ArAdditional process gas line for Argon (Ar) gas controlled by Mass Flow Controller
VSS-MFC-O2Additional process gas line for Oxygen (O2) gas controlled by Mass Flow Controller
VSS-MFC-FGAdditional process gas line for Forming Gas (max. 10 % H2/N2) gas controlled by Mass Flow Controller
FA IIUpgrade with integrated formic acid module with individually controlled process gas line
FA IIIUpgrade with integrated formic acid module (process gas line shared with base VSS system)
FA IVFormic acid mudule with separate gas line and automatic refilling
FA-TTrap for formic acid vapors
FA-T-2Double Trap for formic acid
VSS-FluxHeatHeated cover for sue with flux for avoiding condensating flux
VSS-FTFlux trap
VSS-FT-2Flux trap
VSS-EHExtended chamber height up to 120 mm, including 65 mm diameter viewing window
VSS-LiftPinsUpgrade with Lift pins for lifting up of single wafer (150 mm, 200 mm or 300 mm diameter)
H2Hydrogen option for use of pure hydrogen gas (100% H2)
H2SSafety hood
TC IUpgrade with additional (flexible) thermocouple (not connected to process control, for external data logging)
TC IIAdditional thermocouple to measure on device (plugged in chamber); for external measurement tool (max. 4 pcs)
VAC IVacuum basic up to 3 hPa incl. vacuum sensor and valve
VAC IIVacuum comfort up to 10-3 hPa incl. vacuum sensor and valve
VSS-RCRemote control of top cover opening and closing, including connection to safety of external cabinet
VSS-SISerial interface between VSS system and external PC using USB 2.0 port and through USB 2.0 cable
MMMoisture measurement
OxAtmospheric oxygen analyser
CABCabinet with integrated Universal Heat Exchanger (UHE)
PTUpgrade with 3 colors pat light
VSS-QPAdditional quartz glass plate at top
VSS-HTExtension of max temperature to 600 °C
VSS-THTop heat (power x2), add. lamp field in the top
VSS-ExOHExtended opening from 200 mm to 300 mm
MPMembrane/diaphragm pump (not chemically resistant)
MPCChemically resistant membrane/diaphragm pump
RVPRotary vane pump for vacuum up to 10exp-3 with oil filter
WC IIIClosed loop water cooling system
UHEUniversal Heat exchanger (as alternative to WC-III, requires cooling water for its primary side)

Video

You may also like…

Related products