微雷射焊接系統 MLS系列
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Micro Laser Soldering System MLS-series

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  • Brand：LASERVALL
  • 達至每秒4個錫球放置速度
  • 設備優良率高達99%，焊接精度達±5 µm
  • 快速設備安裝，少於2個月
  • 精細焊接靈活性高，可選用50 µm to 800 µm 焊錫球
  • 可應用於鏡頭模組、音圈馬達、對熱有高敏感度的元件、硬碟等

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