Vacuum Reflow Solder System RSS-210-S
- Brand:德國UNITEMP
- Small foot print
- Applications: flux-less soldering,
flip chip process, adhesive bonding,
solder bump reflowing,
encapsulation of housings,
soldering of power devices,
heat treatment of semiconductor wafers,
prototype development,
quality control, etc.
- Precise ramp up and fast ramp down rates
- The chamber is vacuum sealed and equipped with a viewing window
- Excellent temperature uniformity
- One gas line (Mass Flow Controller) with 5 nlm Nitrogen
- Data logging (USB, Ethernet)
- Hotplate heated by heater cartridges or IR lamps and cooled with water
- 50 programs with 50 steps each