真空迴焊爐 RSO-210

  • 廠牌:德國UNITEMP
  • 應用於使用惰性氣體、氧氣、氫氣、合成氣體、甲酸操作,無助焊劑的回流焊工藝,有鉛和無鉛SMT回流焊,高溫陶瓷氧化鋁混合回流焊,Pin-in-paste 回流焊,半導體,LED貼附。
  • 精確快速的上升和下降率。
  • 最多可接4條氣體管線(質量流量控制器)。
  • 紅外燈加熱。
  • 50個程序,每個程序有50個編程。
  • 集成數據紀錄。
  • 包括石英玻璃托盤和石墨基座。

產品規格

型號RSO-210
最大零件尺寸210 × 210 mm 或8”晶圓
箱體高度40 mm
部件支架帶石墨基座的石英玻璃支架(160 × 160 mm)
真空能力10-3 hPa
最高溫度650°C
溫度均勻性設定溫度的1 %
上升速率高達10 K /min
下降速率T = 650°C > 400°C:200 K/min,T = 400°C > 100°C:30 K/min
流量控制器1個質量流量控制器用於5 nlm=升/分鐘(最多可選3個)
程序控制SIMATIC® 7英吋觸控螢幕,50個程序,每個程序有50個編程
箱體冷卻水冷
基板冷卻氮氣
尺寸W578 × D505 × H570 mm
重量55 kg
電壓3 x 400 V, 3P, +N+PE, 11 kW 或 3 x 208 V, 3P+PE, 10 kW

選購配件

項目說明
FA IIFormic Acid Option with internal gas line and Mass Flow Controller
FA IIIFormic Acid Option , the gas line is shared with the standard nitrogen Mass Flow Controller
FA-IVIntegrated formic acid module with separate MFC for carrier gas (N2) with automatic refilling
FA-TTrap for formic acid vapor (for pump protection)
FTFlux trap (for pump protection)
MFCAdditional process gas line with Mass Flow Controller (max. 3 add) *
MMMoisture Analyser to measure moisture residues in the chamber
OxAtAnOxygen Analyser to measure Oxygen residues (not in combination with Hydrogen Option)
PTAdditional 3 colors pat light
SWSwitchbox for chiller and/or vacuum pump
TCadd. Thermocouple to measure on device (plugged in chamber, (max. 3)
VAC IBasic Vacuum up to 3 hPa, Vacuum sensor, vacuum valve DN16 , ball check valve
VAC IIComfort Vacuum up to 103hPa, Pirani Sensor, vacuum valve DN16, ball check valve
UHE (50 Hz)Oven integrated as floor model into a cabinet with Uni. Heat Exchanger

您可能也喜歡…